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Integration Engineer

Integration Engineer

Analog DevicesBeaverton, OR, US
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About Analog Devices

Analog Devices, Inc. (NASDAQ :  ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at and on and.

Analog Devices is seeking an Experienced Process Integration Engineer to provide support to Manufacturing Operations by leading teams to transfer existing BiCMOS and BJT processes to larger wafer diameters, optimizing existing manufacturing processes, leading teams to resolve technical problems, and interfacing with internal and external customers. Manufacturing processes include analog / mixed-signal device processing, parametric testing, and defect analysis.

Responsibilities include, but not limited to :

  • Technical ownership of BiCMOS and BJT focused manufacturing process flows critical for transfer of existing processes to larger wafer diameters requiring full requalification of each module
  • Harmonization of process steps across process flows for manufacturing efficiency
  • Engineering team leadership to drive yield and parametric problems
  • Optimization of manufacturing processes using design of experiments (DOE)
  • Development and oversight of Action Plans to drive statistical process control (SPC) metrics
  • Evaluation and disposition of material based on electrical tests
  • Interpretation of SEM / TEM images and EDX data to solve electrical and defect problems
  • Support Quality Assurance with customer inquiries and audits
  • Optimization of semiconductor manufacturing processes for manufacturing
  • Writing operational specifications
  • Statistical data analysis and data mining
  • Corrective and Preventative Actions (8D Process)

Minimum qualifications

  • 5+ years experience as a semiconductor process engineer or process integration engineer
  • Master’s or above in Electrical Engineering
  • Strong technical expertise in wafer fabrication processes (Photolithography, chemical mechanical polishing (CMP), diffusion, chemical vapor deposition (CVD), dry and wet etching, rapid thermal annealing (RTA), ion implantation, epitaxial growth, and metallization). Familiarity of gold plating process is a plus
  • Demonstrate in-depth knowledge of silicon semiconductor physics, with a particular focus on complementary metal-oxide-semiconductor (CMOS) and bipolar junction transistor (BJT) technologies.
  • Knowledge of process flows and device structures for CMOS and BJTs
  • Excellent communication skills in difficult / diverse situations; level-headed and articulate as you will be interacting with executive management, key customers, and auditors
  • Understanding of applied statistics (Statistical Process Control)
  • Strong attention to detail and root-cause analysis
  • Basic knowledge of Failure Analysis techniques

    • Job Req Type : ExperiencedRequired Travel : Yes, 10% of the timeShift Type : 1st Shift / DaysThe expected wage range for a new hire into this position is $74,400 to $102,300.

    Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

    This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.

    This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.

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    Integration Engineer • Beaverton, OR, US