ASIC Failure Analysis Engineer

Must Have Technical / Functional Skills

• Bachelor’s in electrical / Electronics Engineering or related required. Master's Preferred
• 5+ years of experience in failure analysis field (preferably semiconductor).
• Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging).
• Should have good knowledge and understanding of the Failure Analysis Techniques used in the nanometer semiconductor manufacturing technologies like 14nm, 10nm, 7nm, etc.
• Knowledge on FA techniques like Cross sectioning, X-ray, CSAM, TDR, FIB, SEM, and TEM is required.
• Fundamental knowledge of fault isolation technique, ATE, Scan / ATPG debug preferred.
• Good understanding of transistor functions and basic electronics.
• Knowledge of JEDEC IC Qualification tests and requirements is beneficial.
• Innovative and Creative with troubleshooting techniques.
• Enjoy hands-on work and working in a lab environment.
• Good customer and vendor management skills.
• Ability to work well in cross-functional teams in a fast-paced, collaborative team environment.
• Ability to work independently, multi-task, and pay good attention to details.

Experience Required

Roles & Responsibilities

LI-CM2