Sr. Photolithography Process Engineer

Photolithography Process Engineer

NXP's Technology & Operations organization plays an essential role in the company's success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers.

Job Summary :

The Photolithography Process Engineer opportunity is in a high-volume semiconductor wafer manufacturing environment. The position requires ownership and responsibility for the control, development and optimization of Photolithography processes and equipment. Prior experience on ASML PAS & Twinscan XT platforms (both hardware & process troubleshooting) is a must-have requirement.

Primary Job Duties :

Lead activities with engineering, production, device and support organizations in a high-volume semiconductor wafer manufacturing environment.

Conduct startup / baselining activities on new scanner installations.

Develop and lead projects to help optimize Quality (yield improvement & defect reduction), Delivery (MTBF, MTTR, qual optimizations, capacity qualifications, cycle time reductions), and Cost (process optimization, chemical usage qualification & consumption reduction).

Participate in fab-to-fab standardization & benchmarking activities related to : tool-to-tool matching, scrap reduction, defect reduction, cost reduction, as well as throughput improvement projects.

Develop processes for new technology / layer introductions.

Maintain, upgrade and monitor wafer fabrication equipment in Photolithography.

Provide innovative, real time, quick response and solutions to line issues to help maintain manufacturing requirements while ensuring the highest level of quality.

Utilize logical and objective data analysis to establish and track metrics to meet department goals.

Additional candidate expectations :

Self-motivated; able to take initiative.

Ability to deal with multiple issues and shifting priorities.

Ability to interact with multiple disciplines in a 7x24 manufacturing facility.

Ability to train, mentor and lead junior engineers and experienced technicians.

Ability to lead task force teams across departments and divisions.

Ability to successfully plan, execute, analyze and deliver projects per schedule and on-time.

Strong data analysis, troubleshooting, teamwork, and communication skills.

Solid knowledge of SPC and FDC and their uses for troubleshooting and making improvements.

Aptitude and desire to learn new skills.

Six Sigma certification and / or use of LEAN improvement tools.

Ability to thrive in a multi-cultural environment.

Job Qualifications :

At least a Bachelor of Science degree in Engineering (Chemical, Electrical, Mechanical or Materials Science)

Requires 5-10 years minimum of engineering experience in a 200mm / 300mm high volume manufacturing environment, preferably in Photolithography.

NXP is an Equal Opportunity / Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and / or expression, marital status, status as a disabled veteran and / or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.