Hardware Development Engineer, AWS CQC Fabrication

The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena CA is looking to hire a Hardware Development Engineer with experience in semiconductor process development and in particular wirebonding flip chip bonding dicing who will aid in AWSs effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group you will solve problems related to the fabrication and characterization of novel quantum processors.

Key job responsibilities

Responsibilities include developing improving and sustaining fabrication and packaging processes; analyzing inline metrology and electrical test data; interacting with project leads to provide feedback that continuously improves the process. Candidates must have a demonstrated background in solid engineering principles and must have superlative data analysis problem solving and communication skills. Successful candidates will have experience in dicing wire-bonding flip chip bonding techniques and tools. Working effectively within a team environment is critical.

A day in the life

The schedule is late afternoon through late night for this role 5pm-2am for example. The initial training will be performed in the day time. Once the training is finished the candidate is expected to work independently in the assigned hours.

The candidate will spend most of the time in a cleanroom environment in a protective suit performing hands-on packaging tasks using IC packaging equipment. The candidate will carry out packaging steps for quantum computing product chips as well as for development projects.

Export Control Requirement Due to applicable export control laws and regulations candidates must be either a U.S. citizen or national U.S. permanent resident (i.e. current Green Card holder) or lawfully admitted into the U.S. as a refugee or granted asylum or be able to obtain a US export license. If you are unsure if you meet these requirements please apply and Amazon will review your application for eligibility.

About the team

The AWS Center for Quantum Computing recognizes that developing quantum computing is a long-term endeavor not a quick process. The team is dedicated to tackling the significant challenges involved in building a functional quantum computer. We are approaching this ambitious goal with enthusiasm and determination.

The fabrication / packaging team within AWS Center for Quantum computing is responsible for delivering quantum computing product chips.

• Bachelors degree in mechanical engineering electrical engineering material science physics or equivalent or Bachelors degree
• Expertise in two or more of the following processes and tools : Flip chip bonding tools wire bonding tools saw dicing stealth dicing electrical probing on wafer / die
• 4 years of industry or academic research experience
• Basic programming skills (e.g. Python Julia MATLAB)
• Experience conducting sophisticated analysis of complex data and translate the results into actionable deliverables messages and presentations
• In addition to skills related to packaging process great to have general working knowledge in one or more of the following device fabrication areas : photo lithography metal / dielectric / silicon etching metal / dielectric thin film deposition
• Experience or knowledge in superconducting microwave devices or superconducting qubits is a plus

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.

Los Angeles County applicants : Job duties for this position include : work safely and cooperatively with other employees supervisors and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees supervisors and staff to ensure exceptional customer service; and follow all federal state and local laws and Company policies. Criminal history may have a direct adverse and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above as well as the abilities to adhere to company policies exercise sound judgment effectively manage stress and work safely and respectfully with others exhibit trustworthiness and professionalism and safeguard business operations and the Companys reputation. Pursuant to the Los Angeles County Fair Chance Ordinance we will consider for employment qualified applicants with arrest and conviction records.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country / region youre applying in isnt listed please contact your Recruiting Partner.

Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $105600 / year in our lowest geographic market up to $185000 / year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge skills and experience. Amazon is a total compensation company. Dependent on the position offered equity sign-on payments and other forms of compensation may be provided as part of a total compensation package in addition to a full range of medical financial and / or other benefits. For more information please visit This position will remain posted until filled. Applicants should apply via our internal or external career site.

Key Skills

Academics,Customer Service,Desktop Support,CNC,Excel,Infection Control

Employment Type : Full-Time

Experience : years

Vacancy : 1

Yearly Salary Salary : 105600 - 185000