Advanced Packaging Modeling Expert

Applied MaterialsSanta Clara, CA, US

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Senior Fea Engineer

Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of science and engineering to make possible the next generations of technology, join us to Make Possible a Better Future.

We are looking for an expert, highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team. This is a critical role focused on developing thermal-mechanical simulations to support the design, development, and qualification of next-generation semiconductor packaging technologies. You will play a key role in shaping the future of advanced packaging by providing simulation-driven insights that influence architecture, materials, and process decisions.

This position offers the opportunity to work at the forefront of semiconductor innovation, collaborating with engineers and researchers across multiple business units including design, process integration, reliability, and manufacturing.

Key responsibilities include :

Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.
Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
Conduct thermal modeling to assess heat dissipation in complex package structures, supporting thermal design optimization and advanced cooling technology development.
Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.
Support technology roadmap development by evaluating new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective.
Drive design-of-experiment (DOE) studies and sensitivity analyses to understand key drivers of package performance and reliability.
Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy.
Document and present simulation methodologies, results, and recommendations to both technical and executive audiences.
Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies.

Required qualifications include :

M.S. or Ph.D. in Mechanical Engineering, Materials Science, Applied Physics, or a related field.

510 years of hands-on industry experience in thermal-mechanical FEA modeling, in the semiconductor or electronics packaging domain.

Thorough understanding of advanced packaging technologies, including flip-chip, fan-out wafer-level packaging (FOWLP), 2.5D / 3D integration, chiplet architectures, and through-silicon vias (TSVs).

Proficient with commercial FEA tools such as ANSYS, Abaqus, COMSOL, or equivalent.

Strong knowledge of materials behavior, including polymers, metals, ceramics, and their interactions under thermal and mechanical loads.

Familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, and reflow.

Excellent analytical, problem-solving, and communication skills.

Proven ability to work independently and collaboratively in a fast-paced, cross-functional environment.

Preferred qualifications include :

Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis.

Familiarity with JEDEC reliability standards and qualification tests (e.g., TCoB, HTS, uHAST, drop test).

Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.

Exposure to package design tools such as Cadence, Mentor Graphics, or equivalent.

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

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Packaging • Santa Clara, CA, US