Assembler
Job Description :
This role will be an assembly operator working withvarious SMT, Die Attach or Wire Bonding equipment.
Responsibilities :
- Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
- Operate and set-up manual Gold wire bonders, manual eutectic / epoxy die attach systems or SMT equipment per documented work instructions.
- Involves working to microcircuit layout drawings; Operator is responsible for proper wire formation, bond appearance and bond strength per Mil Std 883.
- Operator is responsible for proper die attachment, including coverage and die shear strength per Mil Std 883.
- Operator is responsible for proper soldering of components – both manual and automatic per IPC-610 standards.
- Flexibility to be trained in multiple Microelectronics processes that involve other assembly activities.
- Requires significant attention to detail for production activities and documentation to maintain compliance with Mil Standard 883 requirements.
Qualifications :
Ability to set-up, operate and adjust or ability to learn to run a variety of microelectronic production equipment.Minimum of 2 years' experience in microelectronics module assembly area.High School diploma required.Wire-bonding gold wire or ribbon to a variety of die and substrates.Die attach using solder preforms or epoxy to a variety of components.SMT using Mydata pick and place equipment.Operate following all area ESD protocols.Physical Environment and Working Conditions : Clean-room environment with smocks, masks and gloves.Due to ITAR regulations, candidates must be a US Citizen or Permanent Resident.