Purpose of the position Foxconn Technology Group, a globally leading electronics manufacturing company, is now hiring a SMT Process Experiment Engineer. Lead reliability test analysis of SMT (surface mounting technology, Consumer Electronics Industry), such as cross secion / Dye&pry / shear / pull / torsion / FT-IR etc.
Experimental anomaly analysis SMT process defects, such as void, crack, cold solder using SEM / EDS and optical microscopy, data support for process optimization and quality improvement and collaborate with DFM teams to improve designs based on failure mode data. Develop test methodologies for new materials (low temperature solders, Flex PCBs). Duties and Responsibilities 1.
Lead SMT reliability test and analysis :
Lead Line-qualification of SMT lines and progress tracking Education and work experience Educational Requirements :
Validation Engineer • Houston, TX, US