IC Semiconductor Package Designer

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Job Description :

IC / Semiconductor Package Designer

Role Overview

We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture design and productization using advanced node silicon (7nm 5nm 3nm and beyond). This role partners closely with chip design system design SI / PI thermal and manufacturing teams to define and deliver industry-leading package solutions. The ideal candidate has deep technical expertise in substrate design floor-planning bump architecture advanced materials and HVM execution.

Key Responsibilities

Package Architecture Co-Design & Optimization

Collaborate with chip design and analog / digital IP / PHY teams (224G / 112G SerDes PCIe Gen 6 / 7 ADC / DAC etc.) to optimize chip floorplan die bump patterns and IO architecture for advanced node products.

Co-optimize package stack-up layer count escape routing BGA pattern and power integrity architecture aligned to system and manufacturing requirements.

Interpret SI / PI parameters (RL IL NEXT / FEXT etc.) to drive signal integrity optimization.

Package Design & Integration

Work with IC design system engineering SI / PI and thermal teams to perform BGA substrate design using Cadence APD or equivalent tools.

Ensure package designs meet SI / PI mechanical high-power thermal and reliability targets.

Define and refine assembly BOM process flows and design rules for advanced packaging technologies.

Define POR for new silicon nodes including bump metallization geometry and process requirements.

Drive implementation optimization and HVM qualification of new package / assembly technologies.

Program Management & Cross-Functional Execution

Own packaging deliverables from concept through substrate design development qualification and high-volume manufacturing.

Lead interactions with assembly substrate and manufacturing partners for NPI bring-up and production ramp.

Provide sustaining support during HVM including multi-source enablement.

Work closely with QA product / test engineering and customer teams to diagnose and resolve quality reliability or manufacturing issues.

Required Qualifications

Bachelors and 8 years or Masters degree and 6 years or PhD and 3 years of related experience;

BS / MS / PhD in Electrical Engineering (Preferred) Mechanical Engineering Materials Science or related field.

Extensive hands-on experience in advanced IC packaging for advanced silicon nodes.

Expertise in substrate design SI / PI principles thermal management and high-speed IO packaging.

Strong understanding of high layer count large body flip chip BGA packaging technology

Proficiency in Cadence Allegro APD / SIP or comparable packaging design tools.

Experience working with global OSATs and substrate suppliers.

Proven ability to drive NPI through HVM with strong cross-functional leadership.

Excellent communication documentation and customer-facing skills.

Additional Job Description :

Compensation and Benefits

The annual base salary range for this position is $120000 - $192000

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package : Medical dental and vision plans 401(K) participation including company matching Employee Stock Purchase Program (ESPP) Employee Assistance Program (EAP) company paid holidays paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race color creed religion sex sexual orientation national origin citizenship disability status medical condition pregnancy protected veteran status or any other characteristic protected by federal state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA please be sure to fill out a home address as this will be used for future correspondence.

Key Skills

Load & Unload,Ruby,Shipping & Receiving,Forklift,Lift Truck Experience,Basic Math,Packaging,Warehouse Experience,Delivery Driver Experience,Heavy Lifting,Human Resources,RF Scanner

Employment Type : Full-Time

Experience : years

Vacancy : 1

Monthly Salary Salary : 120000 - 192000